Loongson Develops 32+ Core Chiplets For Its Next-Gen 3D7000 CPUs, Based on Sub-10nm Process Technology & Aiming 2027 Release

Loongson has started developing its next-gen "3D7000" CPU family, which will feature over 32 core chiplets. Loongson To Pack Massive 32+ Core Chiplets In Its Next-Gen 3D7000 Server CPUs, Aiming 2027 Release Chinese chip maker Loongson has started the development of its next-gen server CPU family. The lineup, codenamed 3D7000 series, is expected to be released in 2027 and will leverage a sub-10nm process node. As for the predecessor, Loongson has already unveiled its 3C60000 processors, which leverage a 1X nm node, likely 12nm. These chips feature 16-core chiplets and scale up to 64 cores with quad-chiplet models, & up […]

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