TSMC Turned Down NVIDIA CEO’s Request For Dedicated Packaging Production Line – Report

According to a report in the Taiwanese press, Taiwan's contract chip manufacturer TSMC turned down NVIDIA CEO Jensen Huang's request to set up a dedicated packaging manufacturing line for NVIDIA's products. Along with semiconductor fabrication, chip packaging has become an equally important part of the industry's rush to ship thousands of. AI chips worldwide. However, unlike fabrication capacity, packaging has struggled to meet the elevated demand for chips, making TSMC, the world's largest contract chip manufacturer, dedicate considerable resources towards it. TSMC's latest earnings call also focused on packaging, with the firm choosing to redefine its market to add the […]

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