Apple’s A20 Pro With Newer Packaging On iPhone 18 Pro Logic Board Allegedly Leaked, Showing Bigger NPU But No Change To Package Size Compared To A19 Pro

A first look at the iPhone 18 Pro’s logic board shows that the A20 Pro has adopted the new WMCM (Wafer-Level Multi-Chip Module) packaging, with Apple gradually shifting away from the PoP (Package-on-Package) technology used for the A19 Pro. We also see that Apple has once more relied on its chip design prowess to limit the size of the SoC while also making changes to the Neural Engine. Maintaining the same physical size as the A19 Pro allows Apple to lower production costs for the A20 Pro, which are already expensive to mass produce, thanks to TSMC’s 2nm node While the […]

Read full article at https://wccftech.com/a20-pro-packaging-with-bigger-npu-shown-on-iphone-18-pro-motherboard-leak/

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